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Title: A fast test technique for life time estimation of ultrasonically welded Cu-Cu interconnects
Authors: Czerny, Bernhard 
Khatibi, Golta 
Weiss, Brigitte 
Licht, T. 
Issue Date: Sep-2010
Publisher: Elsevier
Source: Microelectronics Reliability, 50(9-11), 1641-1644
Journal: Microelectronics Reliability 
Abstract: In this research the quality of the interconnects of the ultrasonically welded Cu terminals to the Cu substrate in the IGBT-module has been investigated. An ultrasonic resonance fatigue system in combination with a laser Doppler vibrometer and a special specimen design was used for shear fatigue testing of these large ultrasonic Cu-Cu welds (about 0.5 cm2). Fatigue life curves up to 109 loading cycles were obtained in a very short period of time. Using this technique it was possible to evaluate the fatigue strength of these interconnects for the first time. The microstructural features of the interconnects were characterized and their crack growth behaviour was studied. Fracture analysis of the fatigued specimen shows that failure occur due to the propagation of the crack beneath the welding interface into the copper substrate. Additionally performed finite element simulations offer an insight into the stress and strain concentrations during the mechanical fatigue tests. As this method is not restricted to the welding geometry, material joints with larger interconnects can be tested likewise. Thus this new technique can be used as a practical and valid fatigue testing method for evaluation of various interconnects.
ISSN: 0026-2714
DOI: 10.1016/j.microrel.2010.07.130
Appears in Collections:Energie-Umweltmanagement

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