Please use this identifier to cite or link to this item: http://hdl.handle.net/20.500.11790/1662
Title: Thermo-mechanical analysis of bonding wires in IGBT modules under operating conditions
Authors: Czerny, Bernhard 
Lederer, Martin 
Nagl, Bernhard 
Trnka, A. 
Khatibi, Golta 
Thoben, Markus 
Issue Date: Sep-2012
Publisher: Elsevier
Source: Microelectronics Reliability, 52(9-10), 2353-2357
Journal: Microelectronics Reliability 
Abstract: The lifetime of IGBT (Insulated Gate Bipolar Transistor) modules is limited by thermo-mechanical fatigue. Thereby bonding wires represent the critical links where damage initiation is observed. For the first time Laser Doppler Vibrometer measurements and thermal imaging were employed to determine the temperature-dependent deformations of bond wires at different frequencies under operation conditions. This should be considered as an important step to facilitate more precise life-time predictions of power modules in long term usage.
URI: http://hdl.handle.net/20.500.11790/1662
ISSN: 0026-2714
DOI: 10.1016/j.microrel.2012.06.081
Appears in Collections:Energie-Umweltmanagement

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