Please use this identifier to cite or link to this item: http://hdl.handle.net/20.500.11790/1661
Title: In situ vibration measurements on power modules under operating conditions
Other Titles: 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012; Cascais; Portugal; 16 April 2012 through 18 April 2012; Code 89825
Authors: Czerny, Bernhard 
Nagl, Bernhard 
Lederer, Martin 
Trnka, A. 
Khatibi, Golta 
Thoben, Markus 
Issue Date: 16-Apr-2012
Publisher: Elsevier
Source: 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE
Series/Report no.: 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012;6191724
Abstract: The subject of this investigation was determination of thermo-mechanically induced displacement of the components inside a power module under operation conditions. It is well known that lifetime of insulated gate bipolar transistor (IGBT) modules is limited by thermo-mechanical fatigue. Wire bonded interconnects inside the IGBTs count as critical sites where crack initiation and failure is observed. In this study the temperature dependent periodic deformation of wire-bonds under operating conditions was determined by using a laser Doppler vibrometer (LDV) and thermal imaging camera. Furthermore finite element analyses (FEA) were conducted to obtain the strain values needed for lifetime assessments.
URI: https://ieeexplore.ieee.org/document/6191724
http://hdl.handle.net/20.500.11790/1661
ISBN: 978-146731512-8
DOI: 10.1109/ESimE.2012.6191724
Appears in Collections:Energie-Umweltmanagement

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