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Title: Electro-thermal analysis of in situ vibration measurements on IGBT modules under operation conditions
Other Titles: 2012 4th Electronic System-Integration Technology Conference, ESTC 2012; Amsterdam; Netherlands; 17 September 2012 through 20 September 2012; Code 105703
Authors: Czerny, Bernhard 
Nagl, Bernhard 
Lederer, Martin 
Khatibi, Golta 
Thoben, Markus 
Nicolics, Johann 
Issue Date: 17-Sep-2012
Publisher: Elsevier
Source: 2012 4th Electronic System-Integration Technology Conference, ESTC 2012
Series/Report no.: 2012 4th Electronic System-Integration Technology Conference, ESTC 2012;6542120
Abstract: This paper discusses different application relevant electrical loading cases of an IGBT module of a power inverter. Thereby, different operation conditions such as pulse frequencies, inverter output currents and output frequencies, as well as two different operation modes are discussed. Each load case investigation is conducted by electrical, thermal, and in situ vibration measurements. Moreover, on the base of finite element analyses a deeper insight is gained into reliability relevant thermo-mechanical behavior. For this purpose an IGBT module is operated at a load of 30% to 80% of its nominal value in order to cause representative thermo-mechanical displacements of dies and bond wires. By applying an inverter output frequency in a range of 1 to 280 Hz a temperature ripple of up to 40 K on the dies and a vertical displacement of up to 9 μm on a bond wire is observed. These results are important to improve life-time-predictions.
ISBN: 978-146734645-0
DOI: 10.1109/ESTC.2012.6542120
Appears in Collections:Energie-Umweltmanagement

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