Please use this identifier to cite or link to this item: http://hdl.handle.net/20.500.11790/1658
Title: Influence of wirebond shape on its lifetime with application to frame connections
Other Titles: 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013; Wroclaw; Poland; 14 April 2013 through 17 April 2013; Code 98040
Authors: Czerny, Bernhard 
Khatibi, Golta 
Thoben, Markus 
Paul, Indrajit 
Issue Date: 14-Apr-2013
Publisher: Elsevier
Source: 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013
Series/Report no.: 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013;6529909
Abstract: The subject of this study was to investigate the effect of different geometrical loop shapes on the reliability of 400 μm thick Al bond wires in IGBT modules by means of experimental and analytical methods. The experimental fatigue tests have been realized by linear cyclic displacements of 5-45 μm of the contact plates at 200 Hz and 20 kHz. Life time curves were obtained for bond wire connections with different loop heights, distances and angles with the main failure mechanism being wire bond heel cracking. Furthermore an analytical model was developed to calculate the effect of variation of geometrical shape parameters on the stress at different locations of the bond wire. This model can be used to make a preliminary geometry selection of the bond wire and to predict the force or stress at critical sites of the wire bond during stress tests. This model was validated with finite element analysis.
URI: http://hdl.handle.net/20.500.11790/1658
https://ieeexplore.ieee.org/document/6529909
ISBN: 978-146736138-5
DOI: 10.1109/EuroSimE.2013.6529909
10.1109/EuroSimE.2013.6529910
Appears in Collections:Energie-Umweltmanagement

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