Please use this identifier to cite or link to this item: http://hdl.handle.net/20.500.11790/1657
Title: Experimental investigation of transient electrical, thermal and mechanical behavior of IGBT inverter modules during operation
Other Titles: 2013 25th International Symposium on Power Semiconductor Devices and IC's, ISPSD 2013, Kanazawa; Japan, 26 May 2013 through 30 May 2013
Authors: Czerny, Bernhard 
Thoben, Markus 
Khatibi, Golta 
Lederer, Martin 
Nagl, Bernhard 
Nicolics, Johann 
Issue Date: 26-May-2013
Publisher: Elsevier
Source: Proceedings of the International Symposium on Power Semiconductor Devices and ICs, 293-296
Journal: Proceedings of the International Symposium on Power Semiconductor Devices and ICs 
Series/Report no.: Proceedings of the International Symposium on Power Semiconductor Devices and ICs;6694467
Abstract: This study comprises the electrical analysis of an experimental investigation on thermo-mechanical vibration measurements on an IGBT inverter structure under operating conditions and shows a new way how to experience reliability relevant phenomena. In order to perform transient temperature measurements with IR thermography and optical vibration measurements one sub-system of the inverter module was extracted and operated at equivalent conditions. Necessary circuit modifications including parasitic impedances and their most important influences are discussed. The investigation revealed a strong dependence of the thermo-mechanical bonding wire vibrations on the inverter output frequency. At 1 Hz an amplitude of more than 4 μm was measured at the loop peak of a short bonding wire.
URI: http://hdl.handle.net/20.500.11790/1657
https://ieeexplore.ieee.org/document/6694467
ISBN: 978-146735134-8
ISSN: 1063-6854
DOI: 10.1109/ISPSD.2013.6694467
10.1109/EuroSimE.2013.6529909
Appears in Collections:Energie-Umweltmanagement

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