Please use this identifier to cite or link to this item: http://hdl.handle.net/20.500.11790/1651
Title: Reliability analysis of Cu wire bonds in microelectronic packages
Other Titles: 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2016, Montpellier, France, 18 April 2016 through 20 April 2016
Authors: Czerny, Bernhard 
Mazloum-Nejadari, Ali 
Khatibi, Gota 
Lederer, Martin 
Nicolics, Johann 
Weiss, Laurens 
Issue Date: 18-Apr-2016
Publisher: Elsevier
Source: 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2016
Abstract: In this study the thermo-mechanical response of 25 μm Cu wire bonds in an LQFP-EPad package was investigated by numerical and experimental means. The aim was to develop a methodology for fast evaluation of the packages, with focus on wire bond fatigue, by combining FEA and mechanical fatigue testing. The investigations included the following steps: (i) simulation of the warpage induced displacements in the encapsulated LQFP-176-Epad package due to temperature changes, (ii) reproducing the thermally induced stresses in the wire bond loops in an unmolded (non-encapsulated) LQFP package using an accelerated multiaxial mechanical fatigue testing set-up under the displacement amplitudes determined in case (i) and determination of the loading cycles to failure (Nf), (iii) FEA of the experiments performed in (ii) based on the boundary conditions determined in (i) to calculate the states of stress and strain in the wire bonds subjected to multiaxial mechanical cyclic loading. Our investigations confirm that thermal and mechanical cyclic loading results in occurrence of high plastic strains at the heat affected zone (HAZ) above the nail-head, which may lead to fatigue failure of the wire bonds in the packages. The lifetime of wire bonds show a proportional relation between the location and angle of the wire bond to the direction of loading. The calculated accumulated plastic strain in the HAZ was correlated to the experimentally determined Nf values based on the volume weighted averaging (VWA) approach and presented in a lifetime diagram (Δd - Nf) for reliability assessment of Cu wire bonds. The described accelerated test method could be used as a rapid qualification test for the determination of the lifetimes of wire bonds at different positions on the chip as well as for related improvements of package design.
URI: http://hdl.handle.net/20.500.11790/1651
ISBN: 978-150902106-2
DOI: 10.1109/EuroSimE.2016.7463363
Appears in Collections:Energie-Umweltmanagement

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