Please use this identifier to cite or link to this item: http://hdl.handle.net/20.500.11790/1641
Title: Thermomechanical Reliability Investigation of Insulated Gate Bipolar Transistor Module
Other Titles: Proceedings of the International Spring Seminar on Electronics Technology
Authors: Czerny, Bernhard 
Khatibi, Golta 
Liedtke, Magnus 
Nicolics, Johann 
Issue Date: 16-May-2018
Publisher: Elsevier
Source: 41st International Spring Seminar on Electronics Technology, ISSE 2018, Zlatibor, Serbia, 16 May 2018 through 20 May 2018
Series/Report no.: Proceedings of the International Spring Seminar on Electronics Technology;8443619
Abstract: Though, significant efforts have led to high solder joint quality, thermomechanical fatigue and delamination of the solder joints are still considered as one main failure cause in Insulated Gate Bipolar Transistor (IGBT) power modules. Frequently used test procedures such as accelerated power cycling and thermal cycling allow to rate reliability and to predict lifetime under assumed power load conditions. However, these tests are less capable of detecting the root physical failure cause. In this paper a non-destructive thermal method to observe the successive effect of solder layer fatigue is suggested and discussed. Somewhat similar to power cycling, the method is based on an accelerated temperature cycling process where the power component is self-heated. The resulting change of thermal conductivity of the solder joint due to degradation is detected by contactless temperature measurement. First metallurgical analyses confirm the degraded solder structure as cause of the thermal changes due to aging.
URI: http://hdl.handle.net/20.500.11790/1641
ISBN: 978-153865731-7
ISSN: 2161-2528
DOI: 10.1109/ISSE.2018.8443619
Appears in Collections:Energie-Umweltmanagement

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