Please use this identifier to cite or link to this item: http://hdl.handle.net/20.500.11790/1638
Title: Cyclic robustness of heavy wire bonds: Al, AlMg, Cu and CucorAl
Authors: Czerny, Bernhard 
Khatibi, Golta 
Issue Date: Sep-2018
Publisher: Elsevier
Source: Microelectronics Reliability, 88–90, 745-751
Journal: Microelectronics Reliability 
Abstract: Development of advanced electronic packages can be drastically affected by implementation of new materials. The ever increasing demands for high performance and reliable power electronics, raise the need for rapid robustness evaluation of interconnects. In this study the lifetime of heavy wire bonded interconnects, fabricated with different wire material types Al, AlMg, Cu and Al coated Cu (CucorAl) bonded onto direct copper bonded ceramic substrates was investigated. The tests were performed using an accelerated mechanical fatigue testing system, which allows to determine the lifetime of the interconnects with regard to wire bond lift-off failure in a short period of time. Thus, the influence of ultrasonic power variation and the impact of aging on the performance of wire bonds with different material combinations was studied. Cu wire bonds showed clearly the best fatigue performance as well as static shear strength followed by AlMg and Al bonds. Increasing the ultrasonic power results in a higher fatigue resistance of CucorAl in comparison to pure Al wires. In certain cases, the results of the fatigue experiments and static shear tests were found to be contradictory. The presented results suggest that accelerated mechanical fatigue testing can be used as an additional fast method for qualification of interconnects and assessment of the influence of wire material, bond parameter and aging.
URI: http://hdl.handle.net/20.500.11790/1638
DOI: 10.1016/j.microrel.2018.07.003
Appears in Collections:Energie-Umweltmanagement

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