Please use this identifier to cite or link to this item: http://hdl.handle.net/20.500.11790/1635
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dc.contributor.authorCzerny, Bernhardde_at
dc.contributor.authorBuhrkal-Donau, Steffende_at
dc.contributor.authorPopok, Vladimirde_at
dc.contributor.authorKhatibi, Goltade_at
dc.contributor.authorLuo, Haozede_at
dc.contributor.authorIannuzzo, Francescode_at
dc.contributor.authorPedersen, Kristian Bonderupde_at
dc.date.accessioned2021-10-28T09:39:00Z-
dc.date.available2021-10-28T09:39:00Z-
dc.date.issued2019-09-01-
dc.identifier.citationJournal of Materials Science, Materials in Electronics, 30(18), 17040-17045de_at
dc.identifier.issn09574522-
dc.identifier.urihttp://hdl.handle.net/20.500.11790/1635-
dc.description.abstractDegradation of wire bonds under accelerated power cycling tests is compared to that caused by mechanical high-frequency cycling for commercial power devices. Using micro-sectioning approach and optical microscopy it is found that the bond fracture under the mechanical cycling follows the same tendencies as that found under power cycling. Results of shear tests of the mechanically cycled bonds also agree well with the bond cracking tendencies observed by optical microscopy investigations. It is found that reduction of contact area of the wire at the bond/metallization interface due to the crack development follows the Paris-Erdogan law, which defines the degradation rate leading to wire lift-off. The results obtained on mechanical cycling in the current work also show good agreement with literature data on wire bond fracture under power cycling proving that main mechanism for wire lift-off failure is related to the mechanical stress development at the interface with metallization layer. The carried out study also creates a potential to further develop a high-frequency mechanical cycling into an alternative for reliability analysis of wire bonds. However, more studies have to be performed to compare degradation mechanisms occuring under power and mechanical accelerated tests. © 2019, Springer Science+Business Media, LLC, part of Springer Nature.de_at
dc.description.sponsorshipEnergie-Umweltmanagementde_at
dc.language.isoende_at
dc.publisherElsevierde_at
dc.relation.ispartofJournal of Materials Science: Materials in Electronicsde_at
dc.titleComparative study of wire bond degradation under power and mechanical accelerated testsde_at
dc.typeWissenschaftlicher Artikelde_at
dc.identifier.doi10.1007/s10854-019-02050-0-
item.openairetypeWissenschaftlicher Artikel-
item.languageiso639-1en-
item.cerifentitytypePublications-
item.fulltextNo Fulltext-
item.openairecristypehttp://purl.org/coar/resource_type/c_18cf-
item.grantfulltextnone-
crisitem.author.orcid0000-0001-8147-3122-
Appears in Collections:Energie-Umweltmanagement
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