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Title: Application of in-situ non-invasive failure detection methods for wire bonds
Other Titles: 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC), 15.-18. 9. 2020
Authors: Czerny, Bernhard 
Chavan, Vinayak 
Gasser, Christoph 
Rosc, Jördis 
Khatibi, Golta 
Issue Date: 15-Sep-2020
Source: 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC), 2020, 1-6
Series/Report no.: INSPEC Accession Number;20094766
Abstract: Two in-situ failure detection methods by measuring acoustic emissions and transducer responses are presented to investigate the wire bond degradation failure during a highly accelerated mechanical fatigue test. This BAMFIT fatigue test is used to induce cyclic shear stresses in the bond interface until wire bond lift-off, operating at 60 kHz. The task was to incorporate non-invasive failure detection to identify the degree of degradation prior to end of life as an extension to the BAMFIT method and a possible quality control method. The acoustic emission investigations uses a Fabry Perot interferometer to detect high frequency emissions in the vicinity of the wire bond and detecting changes in the first three harmonics to identify a bond degradation. The transducer response approach observes systematic changes in the vibration and the damping behavior of the coupled resonance system by using the transducer as a piezo sensor. The results have shown that defective bond interconnect can be identified as early as ~50% of end of life, using high power but very short vibration pulses, and at ~80% for low power and completely non-invasive pulses. The obtained responses from the presented methods were correlated to the degree of degradation of the bond wire interface, by completing BAMFIT tests until end of life, cross section analysis as well as non-destructive X-ray computer tomography.
ISBN: 9781728162935
DOI: 10.1109/ESTC48849.2020.9229726
Rights: info:eu-repo/semantics/closedAccess
Appears in Collections:Energie-Umweltmanagement

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