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FH Burgenland
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Energie-Umweltmanagement
Thermal Analysis of Multilayer Printed Circuit Boards with Embedded Carbon Black-Polymer Resistors
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Thermal Analysis of Multilayer Printed Circuit Boards with Embedded Carbon Black-Polymer Resistors
Publisher
IEEE
Date Issued
2007-05
Author(s)
Nicolics, Johann
Mündlein, Martin
Hanreich, Gernot
Zluc, A.
Stahr, H.
Franz, M
DOI
10.1109/ISSE.2007.4432819
URI
http://hdl.handle.net/20.500.11790/1495
Conference
30th International Spring Seminar on Electronics Technology
Subjects
glass fibre reinforced plastics
printed circuit layout
printed circuit manufacture
printed circuits
thermal analysis
thermal conductivity
Type
Konferenzbeitrag
Scopus© citations
6
Acquisition Date
Apr 23, 2024
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95
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Apr 23, 2024
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