Please use this identifier to cite or link to this item: http://hdl.handle.net/20.500.11790/1495
Title: Thermal Analysis of Multilayer Printed Circuit Boards with Embedded Carbon Black-Polymer Resistors
Authors: Nicolics, Johann 
Mündlein, Martin 
Hanreich, Gernot 
Zluc, A. 
Stahr, H. 
Franz, M 
Keywords: glass fibre reinforced plastics;printed circuit layout;printed circuit manufacture;printed circuits;thermal analysis;thermal conductivity
Issue Date: May-2007
Publisher: IEEE
Conference: 30th International Spring Seminar on Electronics Technology 
URI: http://hdl.handle.net/20.500.11790/1495
ISBN: 978-1-4244-1217-4
DOI: 10.1109/ISSE.2007.4432819
Rights: info:eu-repo/semantics/closedAccess
Appears in Collections:Energie-Umweltmanagement

SFX Query Show full item record

SCOPUSTM   
Citations

6
checked on Jul 30, 2021

Page view(s)

67
Last Week
0
Last month
1
checked on Aug 3, 2021

Google ScholarTM

Check

Altmetric

Altmetric
Dimensions


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.