Please use this identifier to cite or link to this item: http://hdl.handle.net/20.500.11790/1159
Title: Communication Analysis of Hardware-in-the-Loop Test Method for Heat Pumps and Chillers
Authors: Weyr, Jan 
Schoberer, Thomas 
Stutterecker, Werner 
Keywords: Building Simulation;Hardware-in-the-Loop;Heat Chillers;Heat Pump;LabVIEW Coupling;TRNSYS Coupling
Issue Date: Jan-2019
Publisher: Trans Tech Publications
Source: Applied Mechanics and Materials, 887, 587-596
Journal: Applied Mechanics and Materials 
Description: 12th Envibuild – Buildings and Environment – From Research to Application
URI: http://hdl.handle.net/20.500.11790/1159
ISSN: 1660-9336
DOI: 10.4028/www.scientific.net/AMM.887.587
Rights: info:eu-repo/semantics/closedAccess
Appears in Collections:Schwerpunkt Energie & Umwelt

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