Highly Accelerated Mechanical Lifetime Testing for Wire Bonds in Power Electronics

Source
Journal of Microelectronics and Electronic Packaging, 19 (2), 49–55
Journal
Journal of Microelectronics and Electronic Packaging, 19 (2)
ISSN
1551-4897
Date Issued
2022-06-01
Author(s)
Khatibi, Golta 
DOI
URI
Type
Wissenschaftlicher Artikel