Czerny, Bernhard

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Official Name
Czerny, Bernhard
Main Affiliation
Akademische Titel
Mag. Dr.
Email
bernhard.czerny@fh-burgenland.at
ORCID
Scopus Author ID
36238795900
Status
staff

Research Outputs

2016 2016 2015 2015 2014 2014 0.0 0.0 0.2 0.2 0.4 0.4 0.6 0.6 0.8 0.8 1.0 1.0

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    Publication
    Towards adequate qualification testing of electronic products: Review and extension
    (Elsevier, 2014-12-03)
    Czerny, Bernhard 
    ;
    Khatibi, Golta 
    ;
    Lederer, Martin 
    ;
    Magnien, Julien 
    ;
    Suhir, Ephraim 
    ;
    Nicolics, Johann 
    Electronic product manufacturers are constantly seeking efficient, cost-effective and trustworthy accelerated test (AT) methods to keep up with the today's market demands. At present, accelerated temperature cycling testing is viewed as the state of the art for reliability assessment of electronic products. Accelerated mechanical fatigue testing has been proposed recently as a novel concept and an attractive cost-effective and time-saving qualification alternative for electronic devices. The principle idea of this approach is replacement of thermally induced loading with equivalent and adequate mechanical loading. Using mechanical fatigue testing set-ups, the devices under test can be subjected to single or multi-axial cyclic loading conditions at high frequencies. As a result, physically meaningful lifetime curves can be obtained. The suggested methodologies and procedures enable one to detect the vulnerable sites of the devices in a very short time. Exemplary results for power semiconductor products demonstrate the applicability of the proposed method for qualification of first and second level interconnects. The advantages and limitations of the proposed concept are addressed and discussed in detail.
      41  1
  • No Thumbnail Available
    Publication
    A novel approach for evaluation of material interfaces in electronics
    (2016-03-05)
    Czerny, Bernhard 
    ;
    Khatibi, Golta 
    ;
    Lassnig, Alice 
    ;
    Lederer, Martin 
    ;
    Nicolics, Johann 
    ;
    Magnien, Julien 
    ;
    Suhir, Ephraim 
    The rapid technological advancements and market demands in electronic sector requires application of highly accelerated, still practice relevant reliability assessment methods. At present, accelerated power and temperature cycling tests count as the state of the art for qualification of the devices. However due to physical characteristics of the devices, there are limitations to accelerated thermal and power cycling tests. Further acceleration by exceeding a critical temperature or time reduction may result in occurrence of failure mechanisms other than those encountered in real application or suppressing these failures. An alternative approach for further acceleration of the testing procedures is based on the application of isothermal mechanical fatigue testing at high frequencies (AMT). The principle idea of this approach is replacement of thermally induced strains by means of equivalent mechanical strains. Based on a physics of failure approach, the relevant failure modes in the material interfaces are induced enabling detection of weak sites of the devices in a very short duration of time. In addition of time saving factor a further advantage of mechanical fatigue testing is the possibility of decoupling of thermal, mechanical and environmental stress factors for a more effective investigation and diagnosis. This paper presents an overview of our recent reliability studies on different types of electronic components by using the proposed methodology with the aim to give an insights into the advantages and some restrictions of AMT for qualification of electronic devices.
      61  1Scopus© Citations 4