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Czerny, Bernhard
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Official Name
Czerny, Bernhard
Main Affiliation
Akademische Titel
Mag. Dr.
Email
bernhard.czerny@fh-burgenland.at
ORCID
Scopus Author ID
36238795900
Status
staff
Research Outputs
Now showing 1 - 2 of 2
- PublicationThermo-mechanical analysis of bonding wires in IGBT modules under operating conditions(Elsevier, 2012-09)
; ;Lederer, Martin ;Nagl, Bernhard ;Trnka, A. ;Khatibi, GoltaThoben, MarkusThe lifetime of IGBT (Insulated Gate Bipolar Transistor) modules is limited by thermo-mechanical fatigue. Thereby bonding wires represent the critical links where damage initiation is observed. For the first time Laser Doppler Vibrometer measurements and thermal imaging were employed to determine the temperature-dependent deformations of bond wires at different frequencies under operation conditions. This should be considered as an important step to facilitate more precise life-time predictions of power modules in long term usage.43 2Scopus© Citations 76 - PublicationExperimental and analytical study of geometry effects on the fatigue life of Al bond wire interconnectsThe reliability of power electronic devices is mainly limited due to thermo-mechanical fatigue of the internal bond wire interconnections. The bond wire shape is already defined at the design stage of the device. Thus preliminary lifetime assessments become more and more important in order to satisfy the high quality demands and the short time to market of the devices. In this study a fast experimental test setup is used in order to determine the lifetime of a large number of wire bond shapes. Furthermore an analytical model is applied to calculate optimized wire bond shapes for a given set of parameters. The results of this investigation should help to optimize the shape parameters at an early stage of development using the presented analytical model in combination with the fatigue tests. © 2013 Elsevier Ltd. All rights reserved.
56 2Scopus© Citations 21