Journals Microelectronics Reliability

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Name
Microelectronics Reliability
 
Peer-Review
 
 
Subject Classifications
Ingenieurwissenschaften und Maschinenbau
 
ZDB
 
SJR
SCImago Journal & Country Rank
 

Journal's Article
(All)

Results 1-4 of 4 (Search time: 0.001 seconds).

Issue DateTitleAuthor(s)
12000High resolution thermal simulation of electronic componentsHanreich, Gernot ; Nicolics, Johann ; Musiejovsky, Laszlo 
21-Mar-2016Interface reliability and lifetime prediction of heavy aluminum wire bondsCzerny, Bernhard ; Khatibi, Golta 
32017Reliability of Cu wire bonds in microelectronic packagesCzerny, Bernhard ; Mazloum-Nejadari, Ali ; Khatibi, Golta ; Lederer, Martin ; Nicolis, Johann ; Weiss, Laurens 
4Sep-2017Wire bond degradation under thermo- and pure mechanical loadingCzerny, Bernhard ; Pedersen, Kristian Bonderup ; Nielsen, Dennis A. ; Khatibi, Golta ; Iannuzzo, Francesco ; Popok, Vladimir N. ; Pedersen, Kjeld