Journals Microelectronics Reliability

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Microelectronics Reliability
Subject Classifications
Ingenieurwissenschaften und Maschinenbau
SCImago Journal & Country Rank

Journal's Article

Results 1-6 of 6 (Search time: 0.001 seconds).

Issue DateTitleAuthor(s)
1Sep-2010A fast test technique for life time estimation of ultrasonically welded Cu-Cu interconnectsCzerny, Bernhard ; Khatibi, Golta ; Weiss, Brigitte ; Licht, T. 
2Sep-2018Cyclic robustness of heavy wire bonds: Al, AlMg, Cu and CucorAlCzerny, Bernhard ; Khatibi, Golta 
3Sep-2013Experimental and analytical study of geometry effects on the fatigue life of Al bond wire interconnectsCzerny, Bernhard ; Khatibi, Golta ; Paul, Indrajit ; Thoben, Markus 
4Sep-2016Fatigue testing method for fine bond wires in an LQFP packageCzerny, Bernhard ; Mazloum-Nejadari, Ali ; Khatibi, Golta ; Weiss, Laurens ; Zehetbauer, M. 
5Nov-2020Interface characterization of Cu-Cu ball bonds by a fast shear fatigue methodCzerny, Bernhard ; Khatibi, Golta 
6Sep-2012Thermo-mechanical analysis of bonding wires in IGBT modules under operating conditionsCzerny, Bernhard ; Lederer, Martin ; Nagl, Bernhard ; Trnka, A. ; Khatibi, Golta ; Thoben, Markus