Browsing by Author Czerny, Bernhard


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Showing results 24 to 33 of 33 < previous 
Issue DateTitleAuthor(s)
18-Apr-2016Reliability analysis of Cu wire bonds in microelectronic packagesCzerny, Bernhard ; Mazloum-Nejadari, Ali ; Khatibi, Golta ; Lederer, Martin ; Nicolics, Johann ; Weiss, Laurens 
2017Reliability of Cu wire bonds in microelectronic packagesCzerny, Bernhard ; Mazloum-Nejadari, Ali ; Khatibi, Golta ; Lederer, Martin ; Nicolis, Johann ; Weiss, Laurens 
14-Apr-2013Simulation of stress concentrations in wire-bonds using a novel strain gradient theoryCzerny, Bernhard ; Lederer, Martin ; Nagl, Bernhard ; Trnka, A. ; Khatibi, Golta ; Thoben, Markus 
Dec-2021Step-by-Step Building of a Four Dimensional Fatigue Compatible Regression Model including FrequenciesCzerny, Bernhard ; Castillo, Enrique ; Fernández Lavín, Alfonso Antonio ; Blasón, Sergio ; Khatibi, Golta ; Zareghomsheh, Mohammad 
Sep-2012Thermo-mechanical analysis of bonding wires in IGBT modules under operating conditionsCzerny, Bernhard ; Lederer, Martin ; Nagl, Bernhard ; Trnka, A. ; Khatibi, Golta ; Thoben, Markus 
16-May-2018Thermomechanical Reliability Investigation of Insulated Gate Bipolar Transistor ModuleCzerny, Bernhard ; Khatibi, Golta ; Liedtke, Magnus ; Nicolics, Johann 
3-Dec-2014Towards adequate qualification testing of electronic products: Review and extensionCzerny, Bernhard ; Khatibi, Golta ; Lederer, Martin ; Magnien, Julien ; Suhir, Ephraim ; Nicolics, Johann 
1-Jan-2017Ultraschnelle Prüftechnik für die Zuverlässigkeitsanalyse von Drahtverbindungen in der LeistungselektronikCzerny, Bernhard 
16-May-2019Versatile ultrasonic fatigue testing method with variable load ratio for small scaled samplesCzerny, Bernhard ; Gasser, Christoph ; Khatibi, Golta 
Sep-2017Wire bond degradation under thermo- and pure mechanical loadingCzerny, Bernhard ; Pedersen, Kristian Bonderup ; Nielsen, Dennis A. ; Khatibi, Golta ; Iannuzzo, Francesco ; Popok, Vladimir N. ; Pedersen, Kjeld