Browsing by Author Czerny, Bernhard


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Showing results 11 to 30 of 33 < previous   next >
Issue DateTitleAuthor(s)
1-Sep-2019Comparative study of wire bond degradation under power and mechanical accelerated testsCzerny, Bernhard ; Buhrkal-Donau, Steffen ; Popok, Vladimir ; Khatibi, Golta ; Luo, Haoze ; Iannuzzo, Francesco ; Pedersen, Kristian Bonderup 
Sep-2018Cyclic robustness of heavy wire bonds: Al, AlMg, Cu and CucorAlCzerny, Bernhard ; Khatibi, Golta 
17-Sep-2012Electro-thermal analysis of in situ vibration measurements on IGBT modules under operation conditionsCzerny, Bernhard ; Nagl, Bernhard ; Lederer, Martin ; Khatibi, Golta ; Thoben, Markus ; Nicolics, Johann 
Sep-2013Experimental and analytical study of geometry effects on the fatigue life of Al bond wire interconnectsCzerny, Bernhard ; Khatibi, Golta ; Paul, Indrajit ; Thoben, Markus 
26-May-2013Experimental investigation of transient electrical, thermal and mechanical behavior of IGBT inverter modules during operationCzerny, Bernhard ; Thoben, Markus ; Khatibi, Golta ; Lederer, Martin ; Nagl, Bernhard ; Nicolics, Johann 
25-May-2018Fatigue life time modelling of Cu and Au fine wiresCzerny, Bernhard ; Khatibi, Golta ; Mazloum-Nejadari, Ali ; Delshadmanesh, Mitra ; Lederer, Martin 
Sep-2016Fatigue testing method for fine bond wires in an LQFP packageCzerny, Bernhard ; Mazloum-Nejadari, Ali ; Khatibi, Golta ; Weiss, Laurens ; Zehetbauer, M. 
16-Apr-2012In situ vibration measurements on power modules under operating conditionsCzerny, Bernhard ; Nagl, Bernhard ; Lederer, Martin ; Trnka, A. ; Khatibi, Golta ; Thoben, Markus 
14-Apr-2013Influence of wirebond shape on its lifetime with application to frame connectionsCzerny, Bernhard ; Khatibi, Golta ; Thoben, Markus ; Paul, Indrajit 
Nov-2020Interface characterization of Cu-Cu ball bonds by a fast shear fatigue methodCzerny, Bernhard ; Khatibi, Golta 
1-Mar-2016Interface reliability and lifetime prediction of heavy aluminum wire bondsCzerny, Bernhard ; Khatibi, Golta 
18-Sep-2018Investigation on the Lifetime of Copper Wire Bonds in Electronic Packages under Thermal and Mechanical Cyclic LoadingCzerny, Bernhard ; Lederer, Martin ; Mazloum-Nejadari, Ali ; Khatibi, Golta ; Weiss, Laurens ; Nicolics, Johann 
24-Mar-2020Loop formation effects on the lifetime of wire bonds for power electronicsCzerny, Bernhard ; Ribbeck, Hans-Georg von ; Doehler, Torsten ; Khatibi, Golta ; Geissler, Ute 
18-Apr-2016Reliability analysis of Cu wire bonds in microelectronic packagesCzerny, Bernhard ; Mazloum-Nejadari, Ali ; Khatibi, Golta ; Lederer, Martin ; Nicolics, Johann ; Weiss, Laurens 
2017Reliability of Cu wire bonds in microelectronic packagesCzerny, Bernhard ; Mazloum-Nejadari, Ali ; Khatibi, Golta ; Lederer, Martin ; Nicolis, Johann ; Weiss, Laurens 
14-Apr-2013Simulation of stress concentrations in wire-bonds using a novel strain gradient theoryCzerny, Bernhard ; Lederer, Martin ; Nagl, Bernhard ; Trnka, A. ; Khatibi, Golta ; Thoben, Markus 
Dec-2021Step-by-Step Building of a Four Dimensional Fatigue Compatible Regression Model including FrequenciesCzerny, Bernhard ; Castillo, Enrique ; Fernández Lavín, Alfonso Antonio ; Blasón, Sergio ; Khatibi, Golta ; Zareghomsheh, Mohammad 
Sep-2012Thermo-mechanical analysis of bonding wires in IGBT modules under operating conditionsCzerny, Bernhard ; Lederer, Martin ; Nagl, Bernhard ; Trnka, A. ; Khatibi, Golta ; Thoben, Markus 
16-May-2018Thermomechanical Reliability Investigation of Insulated Gate Bipolar Transistor ModuleCzerny, Bernhard ; Khatibi, Golta ; Liedtke, Magnus ; Nicolics, Johann 
3-Dec-2014Towards adequate qualification testing of electronic products: Review and extensionCzerny, Bernhard ; Khatibi, Golta ; Lederer, Martin ; Magnien, Julien ; Suhir, Ephraim ; Nicolics, Johann