Browsing by Author Weiss, Laurens

Showing results 1 to 4 of 4
Issue DateTitleAuthor(s)
Sep-2016Fatigue testing method for fine bond wires in an LQFP packageCzerny, Bernhard ; Mazloum-Nejadari, Ali ; Khatibi, Golta ; Weiss, Laurens ; Zehetbauer, M. 
18-Sep-2018Investigation on the Lifetime of Copper Wire Bonds in Electronic Packages under Thermal and Mechanical Cyclic LoadingCzerny, Bernhard ; Lederer, Martin ; Mazloum-Nejadari, Ali ; Khatibi, Golta ; Weiss, Laurens ; Nicolics, Johann 
18-Apr-2016Reliability analysis of Cu wire bonds in microelectronic packagesCzerny, Bernhard ; Mazloum-Nejadari, Ali ; Khatibi, Golta ; Lederer, Martin ; Nicolics, Johann ; Weiss, Laurens 
2017Reliability of Cu wire bonds in microelectronic packagesCzerny, Bernhard ; Mazloum-Nejadari, Ali ; Khatibi, Golta ; Lederer, Martin ; Nicolis, Johann ; Weiss, Laurens