Browsing by Author Lederer, Martin

Showing results 1 to 13 of 13
Issue DateTitleAuthor(s)
Mar-2014A New Approach for Evaluation of Fatigue Life of Al Wire Bonds in Power ElectronicsCzerny, Bernhard ; Khatibi, Golta ; Kotas, Agnieszka Betzwar ; Weiss, Brigitte ; Lederer, Martin 
16-Feb-2014A new approach for evaluation of fatigue life of al wire bonds in power electronicsCzerny, Bernhard ; Khatibi, Golta ; Lederer, Martin ; Kotas, Agnieszka Betzwar ; Weiss, Brigitte 
5-Mar-2016A novel approach for evaluation of material interfaces in electronicsCzerny, Bernhard ; Khatibi, Golta ; Lassnig, Alice ; Lederer, Martin ; Nicolics, Johann ; Magnien, Julien ; Suhir, Ephraim 
17-Sep-2012Electro-thermal analysis of in situ vibration measurements on IGBT modules under operation conditionsCzerny, Bernhard ; Nagl, Bernhard ; Lederer, Martin ; Khatibi, Golta ; Thoben, Markus ; Nicolics, Johann 
26-May-2013Experimental investigation of transient electrical, thermal and mechanical behavior of IGBT inverter modules during operationCzerny, Bernhard ; Thoben, Markus ; Khatibi, Golta ; Lederer, Martin ; Nagl, Bernhard ; Nicolics, Johann 
25-May-2018Fatigue life time modelling of Cu and Au fine wiresCzerny, Bernhard ; Khatibi, Golta ; Mazloum-Nejadari, Ali ; Delshadmanesh, Mitra ; Lederer, Martin 
16-Apr-2012In situ vibration measurements on power modules under operating conditionsCzerny, Bernhard ; Nagl, Bernhard ; Lederer, Martin ; Trnka, A. ; Khatibi, Golta ; Thoben, Markus 
18-Sep-2018Investigation on the Lifetime of Copper Wire Bonds in Electronic Packages under Thermal and Mechanical Cyclic LoadingCzerny, Bernhard ; Lederer, Martin ; Mazloum-Nejadari, Ali ; Khatibi, Golta ; Weiss, Laurens ; Nicolics, Johann 
18-Apr-2016Reliability analysis of Cu wire bonds in microelectronic packagesCzerny, Bernhard ; Mazloum-Nejadari, Ali ; Khatibi, Golta ; Lederer, Martin ; Nicolics, Johann ; Weiss, Laurens 
2017Reliability of Cu wire bonds in microelectronic packagesCzerny, Bernhard ; Mazloum-Nejadari, Ali ; Khatibi, Golta ; Lederer, Martin ; Nicolis, Johann ; Weiss, Laurens 
14-Apr-2013Simulation of stress concentrations in wire-bonds using a novel strain gradient theoryCzerny, Bernhard ; Lederer, Martin ; Nagl, Bernhard ; Trnka, A. ; Khatibi, Golta ; Thoben, Markus 
Sep-2012Thermo-mechanical analysis of bonding wires in IGBT modules under operating conditionsCzerny, Bernhard ; Lederer, Martin ; Nagl, Bernhard ; Trnka, A. ; Khatibi, Golta ; Thoben, Markus 
3-Dec-2014Towards adequate qualification testing of electronic products: Review and extensionCzerny, Bernhard ; Khatibi, Golta ; Lederer, Martin ; Magnien, Julien ; Suhir, Ephraim ; Nicolics, Johann