Browsing by Author Khatibi, Golta
Showing results 1 to 20 of 28
next >
Issue Date | Title | Author(s) |
---|---|---|
Sep-2010 | A fast test technique for life time estimation of ultrasonically welded Cu-Cu interconnects | Czerny, Bernhard ; Khatibi, Golta ; Weiss, Brigitte ; Licht, T. |
Mar-2014 | A New Approach for Evaluation of Fatigue Life of Al Wire Bonds in Power Electronics | Czerny, Bernhard ; Khatibi, Golta ; Kotas, Agnieszka Betzwar ; Weiss, Brigitte ; Lederer, Martin |
16-Feb-2014 | A new approach for evaluation of fatigue life of al wire bonds in power electronics | Czerny, Bernhard ; Khatibi, Golta ; Lederer, Martin ; Kotas, Agnieszka Betzwar ; Weiss, Brigitte |
5-Mar-2016 | A novel approach for evaluation of material interfaces in electronics | Czerny, Bernhard ; Khatibi, Golta ; Lassnig, Alice ; Lederer, Martin ; Nicolics, Johann ; Magnien, Julien ; Suhir, Ephraim |
25-Apr-2018 | Accelerated mechanical fatigue interconnect testing method for electrical wire bonds | Czerny, Bernhard ; Khatibi, Golta |
15-Sep-2020 | Application of in-situ non-invasive failure detection methods for wire bonds | Czerny, Bernhard ; Chavan, Vinayak ; Gasser, Christoph ; Rosc, Jördis ; Khatibi, Golta |
1-Sep-2019 | Comparative study of wire bond degradation under power and mechanical accelerated tests | Czerny, Bernhard ; Buhrkal-Donau, Steffen ; Popok, Vladimir ; Khatibi, Golta ; Luo, Haoze ; Iannuzzo, Francesco ; Pedersen, Kristian Bonderup |
Sep-2018 | Cyclic robustness of heavy wire bonds: Al, AlMg, Cu and CucorAl | Czerny, Bernhard ; Khatibi, Golta |
17-Sep-2012 | Electro-thermal analysis of in situ vibration measurements on IGBT modules under operation conditions | Czerny, Bernhard ; Nagl, Bernhard ; Lederer, Martin ; Khatibi, Golta ; Thoben, Markus ; Nicolics, Johann |
Sep-2013 | Experimental and analytical study of geometry effects on the fatigue life of Al bond wire interconnects | Czerny, Bernhard ; Khatibi, Golta ; Paul, Indrajit ; Thoben, Markus |
26-May-2013 | Experimental investigation of transient electrical, thermal and mechanical behavior of IGBT inverter modules during operation | Czerny, Bernhard ; Thoben, Markus ; Khatibi, Golta ; Lederer, Martin ; Nagl, Bernhard ; Nicolics, Johann |
25-May-2018 | Fatigue life time modelling of Cu and Au fine wires | Czerny, Bernhard ; Khatibi, Golta ; Mazloum-Nejadari, Ali ; Delshadmanesh, Mitra ; Lederer, Martin |
Sep-2016 | Fatigue testing method for fine bond wires in an LQFP package | Czerny, Bernhard ; Mazloum-Nejadari, Ali ; Khatibi, Golta ; Weiss, Laurens ; Zehetbauer, M. |
16-Apr-2012 | In situ vibration measurements on power modules under operating conditions | Czerny, Bernhard ; Nagl, Bernhard ; Lederer, Martin ; Trnka, A. ; Khatibi, Golta ; Thoben, Markus |
14-Apr-2013 | Influence of wirebond shape on its lifetime with application to frame connections | Czerny, Bernhard ; Khatibi, Golta ; Thoben, Markus ; Paul, Indrajit |
Nov-2020 | Interface characterization of Cu-Cu ball bonds by a fast shear fatigue method | Czerny, Bernhard ; Khatibi, Golta |
1-Mar-2016 | Interface reliability and lifetime prediction of heavy aluminum wire bonds | Czerny, Bernhard ; Khatibi, Golta |
18-Sep-2018 | Investigation on the Lifetime of Copper Wire Bonds in Electronic Packages under Thermal and Mechanical Cyclic Loading | Czerny, Bernhard ; Lederer, Martin ; Mazloum-Nejadari, Ali ; Khatibi, Golta ; Weiss, Laurens ; Nicolics, Johann |
24-Mar-2020 | Loop formation effects on the lifetime of wire bonds for power electronics | Czerny, Bernhard ; Ribbeck, Hans-Georg von ; Doehler, Torsten ; Khatibi, Golta ; Geissler, Ute |
18-Apr-2016 | Reliability analysis of Cu wire bonds in microelectronic packages | Czerny, Bernhard ; Mazloum-Nejadari, Ali ; Khatibi, Golta ; Lederer, Martin ; Nicolics, Johann ; Weiss, Laurens |